ARTÍCULO
TITULO

Circuit Designs Using Multilayer Technologies - A Novel Low-Loss Low-Crosstalk Interconnect for Broad-Band Mixed-Signal Silicon MMIC's

Kim    
J    
Qian    
Y    
Feng    
G    
Ma    
P    
Judy    
J    
Chang    
M F    
Itoh    
T    

Resumen

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