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Lixia Ying, Zhen Fu, Ke Wu, Chunxi Wu, Tengfei Zhu, Yue Xie and Guixiang Wang
The aim of this paper is to obtain Cu–Sn composite coatings incorporated with PTFE and TiO2 particles, which have superior antiwear and friction reduction properties. Electrodeposition was carried out in a pyrophosphate electrolyte, and the electro...
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Jieshi Chen, Yongzhi Zhang, Zhishui Yu, Peilei Zhang, Wanqin Zhao, Jin Yang and Di Wu
In this work, the effects of electroplated Cu (EP Cu) and Cu addition (0.7%) in Sn solder on the intermetallic compounds (IMCs) growth and void formation were clarified by comparison with solder joints comprising of high purity Cu (HP Cu) substrate and p...
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