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Vincenzo Vinciguerra, Giuseppe Luigi Malgioglio, Antonio Landi and Marco Renna
The successful handling of large semiconductor wafers is crucial for scaling up their production. Early-stage warpage control allows the prevention of undesirable asymmetric warpage, known as wafer bifurcation or buckling. Indeed, even in a gravity-free ...
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Nicholas Fiorentini, Jiandong Huang, Giacomo Cuciniello, Pietro Leandri and Massimo Losa
Stone pavement structures (SPS), also known as stone roads or stone-paved roads, are road pavements constructed using stones as the primary surface material. Different types of SPS exist; historically, irregular-shaped stones with downward protrusions ha...
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Shia-Chung Chen, Bi-Lin Tsai, Cheng-Chang Hsieh, Nien-Tien Cheng, En-Nien Shen and Ching-Te Feng
During an injection molding process, different parts of the molded material are subjected to various thermal?mechanical stresses, such as variable pressures, temperatures, and shear stresses. These variations form different pressure?temperature paths on ...
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Oldrich ?uba, Ondrej Bílek, Milena Kubi?ová, Vladimír Pata and Dagmar Merínská
This study focuses on the flexural properties of the layered wall structures of plastic tanks produced by rotational molding technology. The aim was to assess the possibility of replacing the homogeneous walls of rotationally cast large-volume undergroun...
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Dyi-Cheng Chen, Chen-Kun Huang
Pág. 46 - 49
This study integrated Analytic Hierarchy Process and Taguchi method to investigate into injection molding warpage. The warpage important factor will be elected by Analytic Hierarchy Process (AHP), the AHP hierarchy analysis factor from documents collecte...
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Chen-Yuan Chung
Plastic lenses are light and can be mass-produced. Large-diameter aspheric plastic lenses play a substantial role in the optical industry. Injection molding is a popular technology for plastic optical manufacturing because it can achieve a high productio...
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Dries Vaes, Margot Coppens, Bart Goderis, Wim Zoetelief and Peter Van Puyvelde
Although semi-crystalline polymers are associated with considerably better mechanical properties and thermal stability compared to their amorphous counterparts, using them as feedstock for Fused Filament Fabrication still poses some major challenges. Hen...
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Jiangbo Luo, Yongpeng Wu, Yunna Sun, Guilian Wang, Yanmei Liu, Xiaolin Zhao and Guifu Ding
Low thermal conductivity and large coefficient of thermal expansion (CTE) are the most serious disadvantages of the polymer dielectric for the interposer redistribution layer (RDL). In this paper, a high thermal conductivity and low CTE composite with po...
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Ephraim Suhir and Reza Ghaffarian
In this review, some major aspects of the current underfill technologies for flip-chip (FC) and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), are addressed, with an emphasis on applications, such as aerospace electronics, for w...
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Meng-Chieh Liao, Pu-Shan Huang, Yi-Hsien Lin, Ming-Yi Tsai, Chen-Yu Huang and Te-Chin Huang
Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations (or...
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