6   Artículos

 
en línea
Meng-Chieh Liao, Pu-Shan Huang, Yi-Hsien Lin, Ming-Yi Tsai, Chen-Yu Huang and Te-Chin Huang    
Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations (or... ver más
Revista: Applied Sciences    Formato: Electrónico

 
en línea
Minami Okamoto, Ryohei Yaita, Minoru Sato, Masayoshi Kamijo, Kanako Toyosada, Yasutoshi Shimizu, Kyosuke Sakaue, Wan-Ju Liao, Meng-Chieh Lee and Cheng-Li Cheng    
The purpose of this study was to construct a scheme that makes it possible to compare the relationship between water usage, satisfaction, and physical properties in three countries. The physical properties of the shower were measured using physical prope... ver más
Revista: Water    Formato: Electrónico

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