REVISTA

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

ISSN: 0018-9480 Frecuencia: 12 Formato: Impresa

Tablas de contenido

22 art�culos asociados

Volumen 45 N�mero 10 (2) Parte 0 A�o 1997

Guest Editorial	Solicitud
Tripathi, V K; Sturdivant, R
P�g. 1817 - 1818

MCM Packaging for Present- and Next-Generation High Clock-Rate Digital- and Mixed-Signal Electronic Systems: Areas for Development	Solicitud
Gilbert, B K; Pan, G-W
P�g. 1819 - 1835

When are Transmission-Line Effects Important for On-Chip Interconnections?	Solicitud
Deutsch, A; Kopcsay, C V; Restle, P J; Smith, H H; Katopis, G; Becker, W D;
P�g. 1836 - 1846

Application of System-Level EM Modeling to High-Speed Digital IC Packages and PCB's	Solicitud
Yook, J-G; Katehi, L P B; Sakallah, K A; Martin, R S; Huang, L; Schreyer, T
P�g. 1847 - 1856

An All-Purpose Transmission-Line Model for Interconnect Simulation in SPICE	Solicitud
Celik, M; Cangellaris, A C; Yaghmour, A
P�g. 1857 - 1867

The Finite-Element Method for Modeling Circuits and Interconnects for Electronic Packaging	Solicitud
Polycarpou, A C; Tirkas, P A; Balanis, C A
P�g. 1868 - 1874

Rigorous and Simplified Models for the Capacitance of a Circularly Symmetric Via	Solicitud
Mathis, A W; Peterson, A F; Butler, C M
P�g. 1875 - 1878

Low-Profile Enhanced-Bandwidth PIFA Antennas for Wireless Communications Packaging	Solicitud
Virga, K L; Rahmat-Samii, Y
P�g. 1879 - 1888

Hybrid Electromagnetic Modeling of Noise Interactions in Packaged Electronics Based on the Partial-Element Equivalent-Circuit Formulation	Solicitud
Pinello, W; Cangellaris, A C; Ruehli, A
P�g. 1889 - 1896

High-Frequency Circuit Modeling of Large Pin Count Packages	Solicitud
Sercu, S; Martens, L
P�g. 1897 - 1904

Time-Domain Characterization of Packaging Effects via Segmentation Technique	Solicitud
Righi, M; Tardioli, G; Cascio, L; Hoefer, W J R
P�g. 1905 - 1910

An FDTD-Touchstone Hybrid Technique for Equivalent Circuit Modeling of SOP Electronic Packages	Solicitud
Chen, Y; Harms, P; Mittra, R; Beyene, W T
P�g. 1911 - 1918

Modeling Millimeter-Wave IC Behavior for Flipped-Chip Mounting Schemes	Solicitud
Jackson, R W; Ito, R
P�g. 1919 - 1925

Microwave-Circuit Modeling of High Lead-Count Plastic Packages	Solicitud
Jackson, R W; Rakshit, S
P�g. 1926 - 1933

Automatic Netlist Extraction for Measurement-Based Characterization of Off-Chip Interconnect	Solicitud
Corey, S D; Yang, A T
P�g. 1934 - 1940

Accurate Frequency-Domain Modeling and Efficient Circuit Simulation of High-Speed Packaging Interconnects	Solicitud
Beyene, W T; Schutt-Ainé, J E
P�g. 1941 - 1947

Development of Microwave Package Models Utilizing On-Wafer Characterization Techniques	Solicitud
Chun, C; Pham, A-V; Laskar, J; Hutchison, B
P�g. 1948 - 1954

Determination of Complex Permittivity of Low-Loss Dielectrics	Solicitud
Voelker, R H; Lei, G-T; Pan, G-W; Gilbert, B K
P�g. 1955 - 1960

Spiral Inductors and Transmission Lines in Silicon Technology Using Copper-Damascene Interconnects and Low-Loss Substrates	Solicitud
Burghartz, J N; Edelstein, D C; Jenkins, K A; Kwark, Y H
P�g. 1961 - 1968

An Integrated CMOS Distributed Amplifier Utilizing Packaging Inductance	Solicitud
Sullivan, P J; Xavier, B A; Ku, W H
P�g. 1969 - 1976

A New Approach for the Experimental Circuit Modeling of Coupled Interconnection Structures Based on Causality	Solicitud
Sercu, S; Martens, L
P�g. 1977 - 1980

Coax Via--A Technique to Reduce Crosstalk and Enhance Impedance Match at Vias in High-Frequency Multilayer Packages Verified by FDTD and MoM Modeling	Solicitud
Pillai, E R
P�g. 1981 - 1981