Resumen
The designs of modern electronic technology are complex mechanical systems with many rigid bonds, and their microminiature in many cases has reached the physical limit of the dimensional, charge and energy quantization of components. For such mechanical systems, with non-classical methods for mechanics of fastening of separate structural elements, it is difficult to build a design model, simple enough and at the same time one that well reflects physical and dynamic properties. To ensure mechanical strength of interconnects and ultra-thin electronic components, it is necessary to determine the stress-strain state of structural elements. These reasons necessitate the use of numerical methods to calculate the dynamic parameters of the design of electronic equipment interconnections, which will improve the reliability of the developed tools that meet the requirements of regulatory technical documentation on mechanical characteristics, shorten the time and cost of their creation. Subject matter of this work is the study of beam deformation of constant cross section under the action of axial forces, bending moments and torque relative to the longitudinal axis. Goal this work is to determine the deformation of the elements of the structure of the devices using the stiffness matrix with a known vector of external forces. To achieve this goal, it is necessary to solve the following tasks: to consider the existing methods of description and analysis, which take into account the specificity of the structures and technological processes used to manufacture specific structures MEMS; explore the nature of these methods; calculate displacements and deformations using the finite element method; using the stiffness matrix to determine the deformation of the structural elements of the devices; to calculate the deformation of the beam of constant cross-section under the action of axial forces, bending moments and torque relative to the longitudinal axis. Conclusions: stiffness matrix, constructed using functional analysis, allows for the calculation of deformation of MEMS elements and electronic interconnect flexible.