Resumen
One of the main tasks of improving the informative value of the experiments of high energy physics is to reduce the mass of matter in the detection volume to ensure reducing a probable impact on the parameters of particles under study. At the same time, the informative value of a research is planned to be increased, namely, the solvability of such studies, which, in turn, leads to a significant increase in information flows and the speed of data transmission and processing. The above-mentioned main tasks of improving available experiments and creating new ones in the sphere of physics can be solved due to the development of new design and technological solutions for detector modules, which are the basic cell of modern detection systems of international physics experiments. The constructive and technological approaches to creating detector modules mainly determine the fact whether the mass of the material and the speed of the entire detector system meet the set requirements. The above requirements while creating detector modules can be met if advanced semiconductor sensitive elements (sensors) and multi-layer switching elements with aluminium conductive layers are used. The subject matter of this study is the technology of creating detector modules with the low level of material mass in the detection volume using the advanced thin semiconductor element base. The goal of this work is to create and study ultra-light detector modules and their prototypes at high data transmission rates (over 1 Gbit/s). In order to achieve the goal, the following tasks are to be solved: the advanced HV-MAPS semiconductor sensors should be studied; the material of switching elements should be selected and this selection should be justified; the structure and technology for the detector modules assembly should be chosen. According to the results of the selection of the optimal method for the electrical interconnection of the module components, namely the assembly technology, the constructive and technological requirements for detector modules for the Mu3e experiment should be analyzed; the analysis will determine the structure and composition of the module. Taking into account the above design features, selected materials and technologies for selecting good materials and verifying this selection as well as the assembly technology, the mechanical experimental model of the detector module for Mu3e experiment and the prototype of an ultra-light multi-layer flexible board should be developed and made for studying the impact of signal transmission at speeds over 1 Gbit/s. Conclusions: when performing the work, the experimental models of detector modules and test multi-layer boards were developed, manufactured and studied; these models proved the expected results. The obtained results of studying the manufactured models make further work possible for using these approaches while creating innovative detector modules not only for Mu3e experiment but also for experiments with similar strict requirements for minimizing material mass in the detection volume and high speed of signal transmission, for example, upgrading/improving ATLAS experiment at Large Hadron Collider at CERN.