2   Artículos

 
en línea
Goutham Issac Ashok Kumar, Alexander Lambert, Joshua Caperton, Muthappan Asokan, William Yi and Oliver Chyan    
The introduction of copper as wire bonding material brings about a new challenge of aluminum bond pad bimetallic corrosion at the copper/aluminum galvanic interface. Aluminum is well known to undergo pitting corrosion under halide-contaminated environmen... ver más
Revista: Corrosion and Materials Degradation    Formato: Electrónico

 
en línea
Tayeb Ayad, Tahar Kadri, Ahmed Rezigua     Pág. 412 - 419
AbstractIn this paper, an analytic study is presented to investigate the effect of crack length on the single-lap shear joint under tensile load and to analyze the distribution of adhesive shear stress. A parametric study was conducted in accordance with... ver más
Revista: Revista de la Construcción    Formato: Electrónico

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