Inicio  /  SCRIPTA MATERIALIA  /  Vol: 60 Núm: 9 Par: 0 (2009)  /  Artículo
ARTÍCULO
TITULO

Evaluation of thermal fatigue damage of 200-nm-thick Au interconnect lines

M. Wang    
B. Zhang    
G.P. Zhang    
C.S. Liu    

Resumen

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